ONESEINE TECHNOLOGY CO.,LTD
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12 Layer Multilayer PCB Stack up Circuit Boards For Medical Equipment
Quick detail:
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Material |
FR4 |
Min line |
3/3 |
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Layer |
12 |
Min hole |
0.15mm |
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Surface finish |
HASL lf |
Stack up file |
yes |
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Copper |
2OZ |
Blind hole |
yes |
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Thickness |
1.25MM |
Quantity |
prototype |
12 Layer PCB fabrication:
Your gerber file and stack up file required
Information for fabrication technology
12 Layer pcb prototype fast delivery time 6 working days
12 Layer pcb quotation out within 2 hours
Process Capability
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ltem |
Mass Production |
Prototype |
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Surface Treatment |
HASL(LF) |
HASL(LF) |
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Immersion Gold |
Immersion Gold |
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Flash Gold |
Flash Gold |
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OSP |
OSP |
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Immersion Tin |
Immersion Tin |
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Immersion Silver |
Immersion Silver |
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HASL&Gold Finger |
HASL&Gold Finger |
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selective nickel |
selective nickel |
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HASL(LF) |
smt Pad:>3um |
smt Pad:>4um |
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Big Cu:>lum |
Big Cu:>l.5um |
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Immersion Tin |
0.4-0.8um |
0.8-1.2um |
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Immersion Gold |
Ni:2-5urn |
Ni:3-6urn |
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Au:0.05-0.10um |
Au:0.075-0.15um |
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Immersion Silver |
0.2-0.6um |
0.3-0.6um |
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OSP |
0.1-0.4um |
0.25-0.4um |
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Flash Gold |
Ni:3-6urn |
Ni:3-6urn |
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Au:0.01-0.05um |
Au:0.02-0.075um |
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Laminates |
CEM-3,PTFE |
CEM-3,PTFE |
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FR4 (HighTG etc) |
FR4(HighTG etc) |
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Metal Base(AL,CUetc) |
Metal Base(AL,CUetc) |
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Rogers,etc |
Rogers,etc |
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MAX.Layers |
18(Layers) |
40(Layers) |
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MAX.Board Size |
20"X48" |
20"X48" |
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Board Thickness |
O.4mm~6.0mm |
<O.4mm or >8.0mm |
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Max.Copper Thickness |
inner Layer:16oz |
inner Layer:16oz |
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Outer Layer:16oz |
Outer Layer:16oz |
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Min.Track Width |
3mil/0.075mm |
3mil/0.075mm |
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Min.Track Space |
3mil/0.075mm |
3mil/0.075mm |
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M.in Hole Size |
8mil/0.2mm |
6mil/0.1mm |
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M.in Laser Hole Size |
4mil/0.1mm |
3mil/0.076mm |
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PTH Wall Thickness |
0.8mil/20um |
1.2mil/30um |
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PTH Dia.Tolerance |
±2mil/±50um |
±2mil/±50um |
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Aspect Ratio |
12:1 |
15:1 |
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lmpedance Control |
±5% |
±5% |
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Multilayer PCB production
The production of multilayer PCBs involves several steps, from design and fabrication to assembly and testing. Here is an overview of the typical production process:
1,Design: The design process involves creating the schematic and layout of the PCB using specialized PCB design software. The design includes defining the layer stack-up, trace routing, component placement, and signal integrity considerations. Design rules and constraints are set to ensure manufacturability and reliability.
2,CAM (Computer-Aided Manufacturing) Processing: Once the PCB design is complete, it undergoes CAM processing. CAM software converts the design data into manufacturing instructions, including generating Gerber files, drill files, and layer-specific information required for fabrication.
3,Material Preparation: The PCB fabrication process begins with material preparation. The core material, typically FR-4 fiberglass epoxy, is cut into appropriate panel sizes. Copper foil sheets are also prepared in the required thicknesses for the inner and outer layers.
4,Inner Layer Processing: The inner layer processing involves a series of steps:
a. Cleaning: The copper foil is cleaned to remove any contaminants.
b. Lamination: The copper foil is laminated to the core material using heat and pressure, creating a panel with copper-clad surfaces.
c. Imaging: A photosensitive layer called the photoresist is applied to the panel. The inner layer artwork from the Gerber files is used to expose the photoresist layer, defining the copper traces and pads.
d. Etching: The panel is etched to remove the unwanted copper, leaving behind the desired copper traces and pads.
e. Drilling: Precision holes are drilled in the panel to create vias and component mounting holes.
5,Outer Layer Processing: The outer layer processing involves similar steps as the inner layer, including cleaning, lamination, imaging, etching, and drilling. However, the outer layer processing also includes the application of soldermask and silkscreen layers on the surface for protection and component identification.
6,Multilayer Lamination: Once the inner and outer layers are processed, they are stacked together with layers of prepreg material. The stack is then placed in a hydraulic press and subjected to heat and pressure to bond the layers together, forming a solid multilayer structure.
7,Plating and Surface Finish: The plated-through holes (vias) are electroplated with copper to ensure electrical connectivity between the layers. The exposed copper surfaces are then treated with a surface finish, such as tin, lead-free solder, or gold, to protect them from oxidation and facilitate soldering during assembly.
8,Routing and V-Cut: After the multilayer lamination, the PCB panel is routed to separate individual PCBs. V-cut or scoring techniques may also be used to create perforation lines, allowing easy separation of PCBs after assembly.
9,Assembly: The assembled components and soldering take place on the multilayer PCB. This involves the placement of electronic components onto the PCB, soldering them to the copper pads, and any necessary reflow or wave soldering processes.
10,Testing and Inspection: Once the assembly is complete, the PCBs undergo various testing and inspection procedures to ensure functionality, electrical continuity, and quality. This includes automated optical inspection (AOI), functional testing, and other tests as per the specific requirements.
Packaging and Shipping: The final step involves packaging the PCBs to protect them during transportation and shipping them to the desired destination.