ONESEINE TECHNOLOGY CO.,LTD
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Fluorescent Lamp Aluminum MCPCB Manufacturer Metal Circuit Board
PCB parameter:
Brand:Oneseine
Application: Full range of fluorescent lamps
Maximum size: 1500mm
Substrate material: Aluminum
Thickness: 0.6-2.0mm
Copper foil thickness: 18-70um
Surface treatment: OSP/HAL/HASL (Lead free)
Thermal conductivity: 1.0 – 3.0W/m.k
Breakdown voltage: 1.0-3.0KV(AC)
Flammability: 94V0
Standard: UL & ROHS
Metal Core PCB Variants & Manufacturing Specifications
Material Classification
Metal core PCBs utilize specialized substrates for thermal management:
Aluminum Core (80% market share)
Applications: LED lighting, automotive electronics, power supplies
Advantages: Cost efficiency (¥120-300/m²), thermal conductivity 1-3 W/mK, lightweight (2.7g/cm³)
Copper Core
Applications: RF/microwave systems, high-power converters
Performance: Superior thermal transfer (400 W/mK), 3× aluminum cost, weight penalty (8.96g/cm³)
Iron Alloy Core
Applications: Motor controllers, EMC-sensitive systems
Characteristics: Magnetic permeability >10k μ, thermal conductivity 80 W/mK
Composite Core
Architecture: Aluminum-copper hybrids (e.g., 1.5mm Al + 0.3mm Cu)
Benefit: Balanced thermal-mechanical performance (CTE 14 ppm/°C)
Ceramic Core
Substrates: Al₂O₃ (24-28 W/mK), AlN (170-230 W/mK)
Use Cases: Aerospace power modules, laser diodes
Flexible Metal Core
Construction: Polyimide-on-aluminum (bend radius >5mm)
Applications: Curved displays, wearable medical devices
Production Process
Advanced thermal management PCBs require 18 specialized stages:
Design Phase
Thermal simulation (ANSYS Icepak)
CTE-matching component placement
Base Preparation
Metal core CNC milling (±0.05mm tolerance)
Alkaline degreasing + anodization (Al cores)
Dielectric Lamination
Thermally conductive polymers (e.g., Bergquist HT-04503, 100μm±5μm)
Bonding strength >8N/mm² after 260°C reflow
Circuit Formation
Laser Direct Imaging (25μm feature resolution)
Acidic copper etching (1oz-10oz thickness)
Drilling & Metallization
Laser/mechanical drilling (0.2-6.0mm holes)
Void-free via filling (conductive epoxies)
Surface Finishing
Ni/Au (ENIG): 3-5μm Ni + 0.05-0.1μm Au
Immersion Sn/Ag: Low-cost alternatives
Validation
Thermal cycling (-55°C↔150°C, 500 cycles)
IST testing (1000+ hours @ 150°C)
